Clark Atlanta University has received a $2 million grant from the U.S. National Science Foundation to boost semiconductor research and education at HBCUs.
As the lead institution for this two-year project, CAU will head the HBCU CHIPS Network. This network unites HBCUs, government agencies, academic institutions, and industry partners to advance semiconductor technology and knowledge.
With the grant, CAU will establish the infrastructure needed to involve member institutions in national semiconductor research and workforce development. A key focus will be developing shared facility protocols that leverage the strengths of all participating universities.
Dr. Frances Williams, Vice President for Research and Sponsored Programs at CAU and the project’s principal investigator, stated, “The HBCU CHIPS Network will allow researchers to advance the microelectronics field by leveraging collective research expertise, facilities, and educational resources at HBCUs.” She added, “The CHIPS Network will support investigators in providing innovative solutions to the design and manufacturing of microchips in collaboration with industry partners.”
The initiative will create a vibrant environment for students through meetings and seminars. It will also offer an electronic database that connects students with internships and hands-on learning opportunities in the semiconductor field.
Additionally, the project will drive a collaborative research effort to design and build an integrated microelectronic system, tackling challenges related to packaging and reliability.
The network includes six key partner institutions. Alabama A&M University will develop thermoelectric materials and integrated power/cooling devices. Delaware State University will work on optimizing the integration of 2D and 3D materials. Georgia Institute of Technology will enhance chip-to-system packaging. Jackson State University and North Carolina A&T State University will focus on creating 2D semiconductor devices and optoelectronics. Norfolk State University will explore semiconductor packaging using polymer and boron nitride composites.
Alongside these efforts, North Carolina A&T will also research integrating different types of packaging, aiming to enhance sustainability and efficiency in their operations.
The HBCU CHIPS Network represents a significant leap forward in semiconductor research and education, promising to create new opportunities for students and researchers alike. By leveraging the collective expertise and resources of its partner institutions, the initiative aims to drive innovation and address key challenges in the semiconductor industry.
As CAU and its partners launch this exciting project, they will push the boundaries of semiconductor research and create new opportunities for future scientists and engineers. Their collaboration emphasizes a strong commitment to enhancing education and research at HBCUs and will drive advancements in the microelectronics industry.
